5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VS

Supply voltage

Dual supply, VS = (VS+) – (VS–)

±18

V

Single supply, VS = (VS+) – 0 V

36

VIN+, VIN–

Signal input voltage

±100

V

Signal input current

±1

mA

Output short-circuit(2)

Continuous

TA

Operating temperature

–55

125

°C

Tstg

Storage temperature

–55

125

°C

TJ

Junction temperature

150

°C

Lead temperature (soldering, 10 s)

240

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Short-circuit to VS / 2.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

VS

Supply voltage

Single-supply

4.5

30

36

V

Dual-supply

±2.25

±15

±18

TA

Specified temperature

–40

85

°C

5.4 Thermal Information

THERMAL METRIC(1)

INA146

UNIT

SO-8

8 PINS

RθJA

Junction-to-ambient thermal resistance

110.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

43.6

°C/W

RθJB

Junction-to-board thermal resistance

55.5

°C/W

ψJT

Junction-to-top characterization parameter

6.2

°C/W

ψJB

Junction-to-board characterization parameter

54.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA146

SBOS109A – SEPTEMBER 1999 – REVISED NOVEMBER 2023

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