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OPA333-Q1

SBOS522A – JUNE 2010 – REVISED NOVEMBER 2019

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Copyright © 2010–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be

current-limited to 10 mA or less.

(3)

Short-circuit to ground.

(4)

Long-term high-temperature storage, extended use at maximum recommended operating conditions, or both cases may result in a

reduction of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.

6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

7

V

Signal input pins, voltage(2)

–0.3

(V+) + 0.3

V

Output short circuit(3)

Continuous

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150(4)

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

Device HBM ESD classification level 3A

±4000

V

Charged-device model (CDM), per AEC Q100-011

Device CDM ESD classification level C6

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VS

Supply voltage

1.8

5.5

V

TA

Specified temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

OPA333-Q1

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

220.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

97.5

°C/W

RθJB

Junction-to-board thermal resistance

61.7

°C/W

ψJT

Junction-to-top characterization parameter

7.6

°C/W

ψJB

Junction-to-board characterization parameter

61.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W