5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

6.5

V

VI

Input voltage range(2)

–0.5

VCC + 0.5

V

VO

Output voltage range(2)

–0.5

VCC + 0.5

V

IIK

Input clamp current

VI < 0

–20

mA

IOK

Output clamp current

VO < 0

–20

mA

IOK

Input/output clamp current

VO < 0 or VO > VCC

±400

μA

IOL

Continuous output low current

VO = 0 to VCC

50

mA

IOH

Continuous output high current

VO = 0 to VCC

–4

mA

Continuous current through VCC or GND

±100

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Section 5.3 is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

1500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)

2000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

5.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage

2.5

6

V

VIH

High-level input voltage

0.7 × VCC

VCC + 0.5

V

VIL

Low-level input voltage

–0.5

0.3 × VCC

V

IOH

High-level output current

–1

mA

IOL

Low-level output current

25

mA

TA

Operating free-air temperature

–40

85

°C

5.4 Thermal Information

THERMAL METRIC (1)

PCF8574

UNIT

DGV

DW

N

PW

RGT

RGY

20 PINS

16 PINS

16 PINS

20 PINS

16 PINS

20 PINS

RθJA

Junction-to-ambient thermal resistance

92

76.7

73.1

94.8

56.0

52.2

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

-

45.1

51.9

40.2

67.4

50.6

°C/W

RθJB

Junction-to-board thermal resistance

-

45.8

48.3

58.5

31.2

29.2

°C/W

ψJT

Junction-to-top characterization parameter

-

17.2

29.8

2.8

3.9

3.3

°C/W

ψJB

Junction-to-board characterization parameter

-

45.2

47.9

58.0

31.1

29.1

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

-

n/a

n/a

n/a

15.1

16.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

PCF8574

SCPS068K – JULY 2001 – REVISED SEPTEMBER 2024

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