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TLV316 Datasheet(PDF) 19 Page - Texas Instruments

Part # TLV316
Description  TLVx316-Q1 10-MHz, Rail-to-Rail Input/Output, Low-Voltage, 1.8-V CMOS Operational Amplifiers
PDF  35 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TLV316 Datasheet(HTML) 19 Page - Texas Instruments

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±IN
+IN
V±
VS+
GND
VS±
GND
VOUT
VIN
Run the input traces
as far away from
the supply lines
as possible.
Use a low-ESR,
ceramic bypass
capacitor.
RF
RG
Place components
close to the device
and to each other to
reduce parasitic
errors.
Use a low-ESR,
ceramic bypass
capacitor.
OUT
V+
Copyright © 2016, Texas Instruments Incorporated
19
TLV316-Q1, TLV2316-Q1, TLV4316-Q1
www.ti.com
SBOS845B – NOVEMBER 2016 – REVISED AUGUST 2017
Product Folder Links: TLV316-Q1 TLV2316-Q1 TLV4316-Q1
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
11 Layout
11.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:
•
Noise can propagate into analog circuitry through the power pins of the circuit as a whole and the
operational amplifier. Bypass capacitors reduce the coupled noise by providing low-impedance power
sources local to the analog circuitry.
–
Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
•
Separate grounding for analog and digital portions of the circuitry is one of the simplest and most
effective methods of noise suppression. One or more layers on multilayer PCBs are typically devoted to
ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Take care to
physically separate digital and analog grounds, paying attention to the flow of the ground current. For
more detailed information, see Circuit Board Layout Techniques.
•
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as
possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicularly is much
better than crossing in parallel with the noisy trace.
•
Place the external components as close to the device as possible. Keeping RF and RG close to the
inverting input minimizes parasitic capacitance, as shown in Figure 18.
•
Keep the length of input traces as short as possible. Remember that the input traces are the most
sensitive part of the circuit.
•
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly
reduce leakage currents from nearby traces that are at different potentials.
11.2 Layout Example
Figure 18. Operational Amplifier Board Layout for a Noninverting Configuration



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