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TLV316-Q1, TLV2316-Q1, TLV4316-Q1

www.ti.com

SBOS845B – NOVEMBER 2016 – REVISED AUGUST 2017

Product Folder Links: TLV316-Q1 TLV2316-Q1 TLV4316-Q1

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Copyright © 2016–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Current limit input signals that can swing more than 0.5 V beyond the supply

rails to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

7

V

Signal input pins

Voltage(2)

Common-mode

(V–) – 0.5

(V+) + 0.5

V

Differential

(V+) – (V–) + 0.2

Current(2)

–10

10

mA

Output short-circuit(3)

Continuous

mA

Temperature

Specified, TA

–40

125

°C

Junction, TJ

150

Storage, Tstg

–65

150

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±4000

V

Charged-device model (CDM), per AEC Q100-011

±750

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS

Supply voltage

1.8

5.5

V

Specified temperature range

–40

125

°C