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TLV316 Datasheet(PDF) 8 Page - Texas Instruments

Part # TLV316
Description  TLVx316-Q1 10-MHz, Rail-to-Rail Input/Output, Low-Voltage, 1.8-V CMOS Operational Amplifiers
PDF  35 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TLV316 Datasheet(HTML) 8 Page - Texas Instruments

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TLV316-Q1, TLV2316-Q1, TLV4316-Q1
SBOS845B – NOVEMBER 2016 – REVISED AUGUST 2017
www.ti.com
Product Folder Links: TLV316-Q1 TLV2316-Q1 TLV4316-Q1
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.4 Thermal Information: TLV316-Q1
THERMAL METRIC(1)
TLV316-Q1
UNIT
DBV (SOT-23)
5 PINS
RθJA
Junction-to-ambient thermal resistance
221.7
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
144.7
°C/W
RθJB
Junction-to-board thermal resistance
49.7
°C/W
ψJT
Junction-to-top characterization parameter
26.1
°C/W
ψJB
Junction-to-board characterization parameter
49.0
°C/W
RθJC(bot)
Junction-to-case(bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Thermal Information: TLV2316-Q1
THERMAL METRIC(1)
TLV2316-Q1
UNIT
DGK (VSSOP)
8 PINS
RθJA
Junction-to-ambient thermal resistance
186.6
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
78.8
°C/W
RθJB
Junction-to-board thermal resistance
107.9
°C/W
ψJT
Junction-to-top characterization parameter
15.5
°C/W
ψJB
Junction-to-board characterization parameter
106.3
°C/W
RθJC(bot)
Junction-to-case(bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.6 Thermal Information: TLV4316-Q1
THERMAL METRIC(1)
TLV4316-Q1
UNIT
PW (TSSOP)
14 PINS
RθJA
Junction-to-ambient thermal resistance
117.8
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
46.5
°C/W
RθJB
Junction-to-board thermal resistance
59.6
°C/W
ψJT
Junction-to-top characterization parameter
5.3
°C/W
ψJB
Junction-to-board characterization parameter
59
°C/W
RθJC(bot)
Junction-to-case(bottom) thermal resistance
N/A
°C/W



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