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TMP117MAIDRVT Datasheet(PDF) 43 Page - Texas Instruments |
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TMP117MAIDRVT Datasheet(HTML) 43 Page - Texas Instruments |
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43 / 50 page ![]() www.ti.com PACKAGE OUTLINE C 0.531 MAX 0.22 0.16 0.8 TYP 0.4 TYP 6X 0.27 0.23 0.4 TYP B E A D 4226656/B 03/2021 D: Max = 1.518 mm, Min = 1.458 mm DSBGA - 0.531 mm max height YBG0006-C01 DIE SIZE BALL GRID ARRAY E: Max = 0.98 mm, Min = 0.92 mm NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE 0.05 C A 1 2 0.015 C A B SYMM SYMM B C SCALE 13.000 www.ti.com TMP117 SNOSD82D – JUNE 2018 – REVISED SEPTEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 43 Product Folder Links: TMP117 |
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