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TMP117MAIDRVT Datasheet(PDF) 5 Page - Texas Instruments |
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TMP117MAIDRVT Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 50 page ![]() 6 Specifications 6.1 Absolute Maximum Ratings Over free-air temperature range unless otherwise noted(1) MIN MAX UNIT Supply voltage V+ –0.3 6 V Voltage at SCL, SDA, ALERT and ADD0 –0.3 6 V Operating junction temperature, TJ –55 155 °C Storage temperature, Tstg –65 155 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN NOM MAX UNIT V+ Supply voltage, TA = -55 °C to 150 °C 1.8 3.3 5.5 V V+ Supply voltage, TA = -55 °C to 70 °C 1.7 5.5 V VI/O SCL, SDA, ALERT and ADD0 0 5.5 V TA Operating free-air temperature –55 150 °C 6.4 Thermal Information THERMAL METRIC(1) TMP117 UNIT YBG (DSBGA) DRV (WSON) 6 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 133.2 70.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 1.0 82.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 11.7 °C/W RθJB Junction-to-board thermal resistance 40.9 35.4 °C/W ψJT Junction-to-top characterization parameter 0.1 2.2 °C/W ψJB Junction-to-board characterization parameter 40.7 35.3 °C/W MT Thermal Mass 0.8 5.1 mJ/°C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. www.ti.com TMP117 SNOSD82D – JUNE 2018 – REVISED SEPTEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TMP117 |
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