Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings ....................................... 4

6.2 ESD Ratings .............................................................. 4

6.3 Recommended Operating Conditions ........................4

6.4 Thermal Information ...................................................4

6.5 Electrical Characteristics ............................................5

6.6 I2C Interface Timing ................................................... 6

6.7 Typical Characteristics................................................ 7

7 Detailed Description........................................................8

7.1 Overview..................................................................... 8

7.2 Functional Block Diagram........................................... 8

7.3 Feature Description.....................................................9

7.4 Device Functional Modes..........................................15

7.5 Programming............................................................ 16

8 Application and Implementation.................................. 21

8.1 Application Information............................................. 21

8.2 Typical Application.................................................... 21

9 Power Supply Recommendations................................23

10 Layout...........................................................................23

10.1 Layout Guidelines................................................... 23

10.2 Layout Example...................................................... 23

11 Device and Documentation Support..........................24

11.1 Receiving Notification of Documentation Updates.. 24

11.2 Support Resources................................................. 24

11.3 Trademarks............................................................. 24

11.4 Electrostatic Discharge Caution.............................. 24

11.5 Glossary.................................................................. 24

12 Mechanical, Packaging, and Orderable

Information.................................................................... 24

4 Revision History

Changes from Revision L (December 2015) to Revision M (October 2020)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Changed Absolute maximum Supply voltage of TMP75 from 7 V to 6.5 V....................................................... 4

• Added applicable pins to Input voltage specification.......................................................................................... 4

• Changed Absolute maximum Input Voltage of TMP75 on SCL, SDA, A0, and A1 pins from 7 V to 6.5 V........ 4

• Changed Absolute maximum of TMP75 A2 pin voltage from 7 V to (V+)+0.3...................................................4

• Removed ESD Machine Model specification from TMP75................................................................................. 4

• Updated TMP75 D and DGK package Thermal Information.............................................................................. 4

• Updated TMP175 D package Thermal Information............................................................................................ 4

• Added register settings to Conversion time specification for clarity....................................................................5

• Changed minimum Data setup specification time from 10 ns to 20 ns...............................................................6

• Moved Timeout specification to I2C Interface Timing table................................................................................ 6

• Changed TMP75 Timeout specification minimum from 25 to 20....................................................................... 6

• Changed TMP75 Timeout specification maximum from 74 to 30....................................................................... 6

• Removed BYTE column from the Configuration Register table........................................................................17

• Changed TMP75 consecutive fault setting F[1:0] = 11 from 6 to 4 and F[1:0] = 10 from 4 to 3. ..................... 18

• Added behavior clarification when changing thermostat modes on TMP75..................................................... 19

• Changed bypass capacitor recommendation from 0.1 μF to 0.01 μF...............................................................21

• Updated recommened pull-up resistor size to standard 4.7 kΩ .......................................................................21

• Removed Related Links section....................................................................................................................... 24

• Added Receiving Notification of Documentation Updates section....................................................................24

Changes from Revision K (April 2015) to Revision L (December 2015)

Page

• Changed second Features bullet: added NIST Traceable to TMP75 device .....................................................1

• Added last paragraph to Description section ..................................................................................................... 1

• Deleted Simplified Schematic figure from page 1 ..............................................................................................1

• Changed Figure 7-1 .........................................................................................................................................13

Changes from Revision J (December 2007) to Revision K (April 2015)

Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and

Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................. 1

TMP175, TMP75

SBOS288M – JANUARY 2004 – REVISED DECEMBER 2020

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