6 Specifications

6.1 Absolute Maximum Ratings

Over free-air temperature range unless otherwise noted(1)

MIN

MAX

UNIT

Power Supply, V+

TMP175

7

V

TMP75

6.5

V

Input voltage

TMP175, SCL, SDA, A2, A1, A0

-0.5

7

V

TMP75 SCL, SDA, A1, A0

-0.3

6.5

V

TMP75 A2 pin

-0.3

(V+) +0.3

V

Input current

TMP175

10

mA

Operating Temperature

-55

127

°C

Operating junction temperature, TJ

150

°C

Storage temperature, Tstg

-60

130

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1000

Electrostatic discharge

(TMP175)

Machine model (MM)

±300

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

V+

Supply voltage

2.7

5.5

V

TA

Operating ambient temperature

-40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TMP75

TMP75

TMP175

TMP175

UNIT

DGK(VSSOP)

D(SOIC)

DGK(VSSOP)

D(SOIC)

8-pins

8-pins

8-pins

8-pins

RθJA

Junction-to-ambient thermal resistance

202.5

130.4

185

130.4

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

82

76.9

76.1

70.7

°C/W

RθJB

Junction-to-board thermal resistance

124.4

72.3

106.4

73.9

°C/W

ψJT

Junction-to-top characterization parameter

17.9

32

14.1

21.6

°C/W

ψJB

Junction-to-board characterization parameter

122.6

71.9

104.8

73.1

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

__

__

__

__

°C/W

MT

Thermal Mass

16.6

64.2

__

__

mJ/°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

TMP175, TMP75

SBOS288M – JANUARY 2004 – REVISED DECEMBER 2020

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