11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, Improve Stability Issues with Low CON Multiplexers application brief

• Texas Instruments, Improving Signal Measurement Accuracy in Automated Test Equipment application brief

• Texas Instruments, Multiplexers and Signal Switches Glossary application report

• Texas Instruments, QFN/SON PCB Attachment application report

• Texas Instruments, Quad Flatpack No-Lead Logic Packages application report

• Texas Instruments, Simplifying Design with 1.8 V logic Muxes and Switches application brief

• Texas Instruments, System-Level Protection for High-Voltage Analog Multiplexers application report

• Texas Instruments, True Differential, 4 x 2 MUX, Analog Front End, Simultaneous-Sampling ADC Circuit

application report

• Texas Instruments, Ultrasonic sensing subsystem reference design for gas flow measurement reference

design

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (August 2022) to Revision F (July 2024)

Page

• Updated IIH specification....................................................................................................................................6

Changes from Revision D (March 2022) to Revision E (August 2022)

Page

• Changed the status of the QFN package from: preview to: active .................................................................... 1

TMUX7219

SCDS407F – NOVEMBER 2020 – REVISED JULY 2024

www.ti.com

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Product Folder Links: TMUX7219