6

TPA3251

SLASE40D – MAY 2015 – REVISED APRIL 2016

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7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

PVDD_x

Half-bridge supply

DC supply voltage

12

36

38

V

GVDD_x

Supply for logic regulators and gate-drive

circuitry

DC supply voltage

10.8

12

13.2

V

VDD

Digital regulator supply voltage

DC supply voltage

10.8

12

13.2

V

RL(BTL)

Load impedance

Output filter inductance within

recommended value range

2.7

4

Ω

RL(SE)

1.5

3

RL(PBTL)

1.6

2

LOUT(BTL)

Output filter inductance

Minimum output inductance at IOC

5

μH

LOUT(SE)

5

LOUT(PBTL)

5

FPWM

PWM frame rate selectable for AM

interference avoidance; 1% Resistor

tolerance

Nominal

575

600

625

kHz

AM1

475

500

525

AM2

430

450

470

R(FREQ_ADJ)

PWM frame rate programming resistor

Nominal; Master mode

9.9

10

10.1

k

Ω

AM1; Master mode

19.8

20

20.2

AM2; Master mode

29.7

30

30.3

CPVDD

PVDD close decoupling capacitors

1.0

μF

ROC

Over-current programming resistor

Resistor tolerance = 5%

22

30

k

Ω

ROC(LATCHED)

Over-current programming resistor

Resistor tolerance = 5%

47

64

k

Ω

V(FREQ_ADJ)

Voltage on FREQ_ADJ pin for slave

mode operation

Slave mode

3.3

V

TJ

Junction temperature

0

125

°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

Thermal data are obtained with 85°C heat sink temperature using thermal compound with 0.7W/mK thermal conductivity and 2mil

thickness. In this model heat sink temperature is considered to be the ambient temperature and only path for dissipation is to the

heatsink.

7.4 Thermal Information

THERMAL METRIC(1)

TPA3251D2

UNIT

DDV 44-PINS HTSSOP

JEDEC STANDARD

4 LAYER PCB

FIXED 85°C

HEATSINK

TEMPERATURE(2)

RθJA

Junction-to-ambient thermal resistance

50.7

2.5(2)

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.36

0.2

RθJB

Junction-to-board thermal resistance

24.4

n/a

ψJT

Junction-to-top characterization parameter

0.19

0.5

ψJB

Junction-to-board characterization parameter

24.2

n/a

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

n/a