6 Specifications

6.1 Absolute Maximum Ratings

specified at TJ = –40°C to 125°C (unless otherwise noted); all voltages are with respect to GND(1)

MIN

MAX

UNIT

Voltage

VIN

–0.3

32

V

VEN

–0.3

7

VOUT

–0.3

7

Maximum output current

IOUT

Internally limited

Output short-circuit duration

Indefinite

Continuous total power dissipation

PDISS

See Thermal Information

Operating junction temperature, TJ

–55

150

°C

Storage temperature, Tstg

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 2-kV HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

2.7

30

V

VOUT

Output voltage

1.2

6.5

V

VEN

Enable voltage

0

6.5

V

TJ

Operating junction temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TPS709

UNIT

DBV

DRV

5 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

212.1

73.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

78.5

97.0

°C/W

RθJB

Junction-to-board thermal resistance

39.5

42.6

°C/W

ψJT

Junction-to-top characterization parameter

2.86

2.9

°C/W

ψJB

Junction-to-board characterization parameter

38.7

42.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

12.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TPS709

SBVS186H – MARCH 2012 – REVISED JULY 2021

www.ti.com

4

Submit Document Feedback

Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: TPS709