| Electronic Components Datasheet Search |
|
DM505LRBABF Datasheet(PDF) 248 Page - Texas Instruments |
|
|
|||||||||||||||||||||||||||||
DM505LRBABF Datasheet(HTML) 248 Page - Texas Instruments |
|
248 / 295 page ![]() ddrx_ck 1 PCB_DDR2_0 248 DM505 SPRS976E – NOVEMBER 2016 – REVISED MAY 2018 www.ti.com Submit Documentation Feedback Applications, Implementation, and Layout Copyright © 2016–2018, Texas Instruments Incorporated • Maintain a common ground reference for all bypass and decoupling capacitors. • Take into account the differences in propagation delays between microstrip and stripline nets when evaluating timing constraints. 7.8.2 DDR2 Board Design and Layout Guidelines 7.8.2.1 Board Designs TI only supports board designs that follow the guidelines outlined in this document. The switching characteristics and the timing diagram for the DDR2 memory controller are shown in Table 7-22 and Figure 7-37. Table 7-22. Switching Characteristics Over Recommended Operating Conditions for DDR2 Memory Controller NO. PARAMETE R DESCRIPTION MIN MAX UNIT DDR21 tc(DDR_CLK) Cycle time, DDR_CLK 2.5 8 ns Figure 7-37. DDR2 Memory Controller Clock Timing 7.8.2.2 DDR2 Interface This section provides the timing specification for the DDR2 interface as a PCB design and manufacturing specification. The design rules constrain PCB trace length, PCB trace skew, signal integrity, cross-talk, and signal timing. These rules, when followed, result in a reliable DDR2 memory system without the need for a complex timing closure process. For more information regarding the guidelines for using this DDR2 specification, see the Understanding TI’s PCB Routing Rule-Based DDR Timing Specification Application Report (Literature Number: SPRAAV0). 7.8.2.2.1 DDR2 Interface Schematic Figure 7-38 shows the DDR2 interface schematic for a x32 DDR2 memory system. In Figure 7-39 the x16 DDR2 system schematic is identical except that the high-word DDR2 device is deleted. When not using all or part of a DDR2 interface, the proper method of handling the unused pins is to tie off the ddrx_dqsi pins to ground via a 1k-Ω resistor and to tie off the ddrx_dqsni pins to the corresponding vdds_ddrx supply via a 1k-Ω resistor. This needs to be done for each byte not used. The vdds_ddrx and ddrx_vref0 power supply pins need to be connected to their respective power supplies even if DDRx is not being used. All other DDR interface pins can be left unconnected. Note that the supported modes for use of the DDR EMIF are 32-bits wide, 16-bits wide, or not used. |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |