6.4 Thermal Information

THERMAL METRIC(1)

ISO154x-Q1

UNIT

D (SOIC)

8 PINS

RθJA

Junction-to-ambient thermal resistance

114.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

69.6

°C/W

RθJB

Junction-to-board thermal resistance

55.3

°C/W

ψJT

Junction-to-top characterization parameter

27.2

°C/W

ψJB

Junction-to-board characterization parameter

54.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

PD

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150 °C, C1

= 20 pF, C2 = 400 pF; R1 = 1.4 kΩ, R2 =

94 Ω; Input a 1-MHz 50% duty cycle clock

signal

105

mW

PD1

Maximum power dissipation (side-1)

37

mW

PD2

Maximum power dissipation (side-2)

68

mW

ISO1540-Q1, ISO1541-Q1

SLLSEX0D – NOVEMBER 2016 – REVISED DECEMBER 2022

www.ti.com

6

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: ISO1540-Q1 ISO1541-Q1