6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VIO

IO to GND

–0.3

6

V

Continuous power dissipation (TA = 70°C)

100

mW

TJ

Junction temperature

150

°C

Lead temperature (soldering, 10 s)

300

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings — JEDEC

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±15000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings — IEC

VALUE

UNIT

V(ESD)

Electrostatic

discharge

IEC 61000-4-2 contact discharge

±25000

V

IEC 61000-4-2 air-gap discharge

±25000

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIO

I/O to GND

0

5.5

V

TA

Ambient temperature

–40

85

°C

6.5 Thermal Information

THERMAL METRIC(1)

TPD4F202

TPD6F202

UNIT

YFU (DSBGA)

YFU (DSBGA)

10 PINS

15 PINS

RθJA

Junction-to-ambient thermal resistance

91.8

72

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

1

0.6

°C/W

RθJB

Junction-to-board thermal resistance

19.7

14.1

°C/W

ψJT

Junction-to-top characterization parameter

0.5

0.3

°C/W

ψJB

Junction-to-board characterization parameter

19.7

14.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

www.ti.com

TPD4F202, TPD6F202

SLLS800B – JUNE 2010 – REVISED MAY 2021

Copyright © 2022 Texas Instruments Incorporated

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