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XCL219 Datasheet(PDF) 3 Page - Torex Semiconductor

Part # XCL219
Description  HiSAT-COT ® Control 1.0A Inductor Built-in Step-Down “micro DC/DC” Converters
PDF  20 Pages
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Manufacturer  TOREX [Torex Semiconductor]
Direct Link  http://www.torex.co.jp
Logo TOREX - Torex Semiconductor

XCL219 Datasheet(HTML) 3 Page - Torex Semiconductor

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XCL219/XCL220
Series
■PIN CONFIGURATION
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
1
Lx
Switching Output
2
AGND
Analog Ground
3
VOUT
Fixed Output Voltage PIN
4
CE
Chip Enable
5
PGND
Power Ground
6
VIN
Power Input
7
L1
Inductor Electrodes
8
L2
Inductor Electrodes
■FUNCTION TABLE
CE PIN Function
PIN NAME
SIGNAL
STATUS
CE
Low
Stand-by
High
Active
* Please do not leave the CE pin open.
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
All voltages are described based on the GND (AGND and PGND) pin.
(*1) The maximum value should be either VIN+0.3 or +6.2 in the lowest voltage
(*2) The maximum value should be either VIN+0.3 or +4.0 in the lowest voltage
(*3) The power dissipation figure shown is PCB mounted and is for reference only.
The mounting condition is please refer to PACKAGING INFORMATION.
PARAMETER
SYMBOL
RATINGS
UNITS
VIN Pin Voltage
VIN
-0.3 ~ + 6.2
V
LX Pin Voltage
VLx
- 0.3 ~ VIN + 0.3 or + 6.2 (*1)
V
VOUT Pin Voltage
Vout
- 0.3 ~ VIN + 0.3 or + 4.0 (*2)
V
CE Pin Voltage
VCE
- 0.3 ~ + 6.2
V
Power Dissipation
Pd
1000(40mm x 40mm Standard board) (*3)
mW
Operating Ambient Temperature
Topr
- 40 ~ + 105
Storage Temperature
Tstg
- 55 ~ + 125
BOTTOM VIEW
L1
L2
7
8
VIN
PGND
CE
Lx
AGND
VOUT
1
2
3
4
5
6
* It should be connected the pin No.2 and 5 to the GND pin.
* If the dissipation pad needs to be connected to other pins, it should be
connected to the GND pin.
* Please refer to pattern layout page for the connecting to PCB.



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