5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

PARAMETER

PACKAG

E

MIN

MAX UNIT

Ppp

IEC 61000-4-5 Power (tp – 8/20 µs) at 25°C

All

Packages

210

W

Ipp

IEC 61000-4-5 current (tp – 8/20 µs) at 25°C

SOT-23 &

SC-70

5.7

A

DFN1110-

3

4.7

A

TA

Operating free-air temperature

-55

150

°C

TJ

Junction temperature

-55

150

°C

Tstg

Storage temperature

-65

155

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

5.2 ESD Ratings—IEC Specification

over TA = 25°C (unless otherwise noted)

PARAMETER

TEST CONDITION

VALUE

UNIT

V(ESD)

Electrostatic discharge

IEC 61000-4-2 Contact Discharge, all pins

±30000

V

V(ESD)

Electrostatic discharge

IEC 61000-4-2 Air Discharge, all pins

±30000

V

5.3 Recommended Operating Conditions

PARAMETER

MIN

NOM

MAX

UNIT

VIN

Input voltage

-24

24

V

TA

Operating free-air temperature

-55

150

°C

5.4 Thermal Information

THERMAL METRIC(1)

ESD752

UNIT

DBZ (SOT-23)

DCK (SOT-323 / SC-70)

DXA (DFN1110-3)

3 PINS

3 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance

291.5

283.0

284.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

147.1

164.1

147.9

°C/W

RθJB

Junction-to-board thermal resistance

131.1

105.1

127.4

°C/W

ΨJT

Junction-to-top characterization parameter

32.0

67.1

12.0

°C/W

ΨJB

Junction-to-board characterization parameter

130.2

104.4

126.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

ESD752

SLVSJ54A – DECEMBER 2025 – REVISED DECEMBER 2025

www.ti.com

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