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PCA9601DP Datasheet(PDF) 26 Page - NXP Semiconductors |
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PCA9601DP Datasheet(HTML) 26 Page - NXP Semiconductors |
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26 / 31 page  NXP Semiconductors PCA9601 Dual bidirectional bus buffer 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature MSL: Moisture Sensitivity Level Figure 29. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 13 Abbreviations Acronym Description CDM Charged-Device Model ESD ElectroStatic Discharge HBM Human Body Model I2C-bus Inter-Integrated Circuit bus I/O Input/Output IC Integrated Circuit PMBus Power Management Bus SCL Serial Clock Line SDA Serial DAta line SMBus System Management Bus TTL Transistor-Transistor Logic Table 10. Abbreviations PCA9601 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved. Product data sheet Rev. 3.1 — 4 January 2022 26 / 31 |
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