DAC39RF10 datasheet(11/232 Pages) TI2

11 / 232 page

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage range

VDDA18A, VDDA18B(1)

1.71

1.8

1.89

VEEAM18, VEEBM18(1)

-1.89

-1.8

-1.71

VDDCLK18, VDDSYS18, VDDR18(2)

1.71

1.8

1.89

VDDLB, VDDLA, VDDCLK10(2)

0.95

1.05

VDDIO(3)

1.71

1.8

1.89

VQPS(3)

1.89

VDDDIG, VDDEB, VDDEA, VDDT(3)

0.95

1.05

VCMI

Input common mode voltage

CLK+, CLK–(2) (4)

0.4

VCMI

Input common mode voltage

SYSREF+, SYSREF–(2) (4)

0.4

1.0

VID

Input differential peak-to-peak voltage

SYSREF+ to SYSREF–

800

1000

2000

mVPP-DIFF

CLK+ to CLK–, fCLK < 5GHz

800

1000

1400

mVPP-DIFF

CLK+ to CLK–, 5GHz < fCLK < 7.5GHz

800

1000

1800

mVPP-DIFF

CLK+ to CLK–, fCLK > 7.5GHz

800

1000

2000

mVPP-DIFF

DCMIN

CLK+/– duty cycle minimum

DCMAX

CLK+/– duty cycle maximum

Operating free-air temperature

-55

125

°C

Operating Junction Temperature

150(5)

°C

(1)

Measured to AGND.

(2)

Measured to VSSCLK.

(3)

Measured to DGND.

(4)

SYSREF+/- termination has two options. In option 1 the inputs are weakly self-biased to the optimal common mode voltage, which is

appropriate for AC coupling. In option 2, each input terminal is connected through 50Ohms to ground, which is appropriate to level shift

from a higher common mode voltage.

(5)

Die is designed for Tj = 150 °C operation and for device and die metallization degradation up to 150,000 POH continuous operation at

Tj = 122 °C. Prolonged use above a junction temperature of Tj =105 °C may, however, increase the package failure-in-time (FIT) rate.

6.4 Thermal Information

THERMAL METRIC(1)

17mm × 17mm FC-BGA

UNIT

256 PINS

RθJA

Junction-to-ambient thermal resistance

15.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.9

°C/W

RθJB

Junction-to-board thermal resistance

4.2

°C/W

ΨJT

Junction-to-top characterization parameter

0.4

°C/W

ΨJB

Junction-to-board characterization parameter

4.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

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DAC39RF10-SP, DAC39RF10-SEP

DAC39RFS10-SP, DAC39RFS10-SEP

SBAS932A – MARCH 2024 – REVISED FEBRUARY 2026

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