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+

−

THS6182a

+18 V

+

−

1:1.6

+18 V

4.87

Ω

100

Ω

750

Ω

750

Ω

CODEC

V

IN−

CODEC

4.87

Ω

20-dBm

Line

Power

THS6182b

1.33 kW

1 kW

1 kW

PIN ASSIGNMENTS

20

19

18

17

16

15

14

13

12

11

D1 IN−

D1 OUT

V

−

GND

GND

GND

GND

D1 IN+

BIAS−2

BIAS−1

D2 IN−

D2 OUT

GND

GND

GND

GND

D2 IN+

IADJ

N/C

1

2

3

4

5

6

7

8

9

10

THS6182

SOIC−20 (DW) AND

SOIC−20 PowerPAD

™ (DWP) PACKAGES

(TOP VIEW)

16

15

14

13

12

11

10

9

D1 IN−

D1 OUT

V CC −

GND

GND

D1 IN+

BIAS−2

BIAS−1

D2 IN−

D2 OUT

VCC +

GND

GND

D2 IN+

IADJ

N/C

1

2

3

4

5

6

7

8

THS6182

SOIC−16 (D) PACKAGE

(TOP VIEW)

N/C

VCC−

N/C

N/C

N/C

N/C

GND

N/C

VCC+

N/C

N/C

N/C

N/C

GND

Power

PAD

TM

THS6182

Leadless 24−pin PowerPAD

™

4 mm X 5 mm (RHF) PACKAGE

(TOP VIEW)

VCC +

CC

1

2

3

4

5

6

7

19

18

17

16

15

14

13

8

9 10 11 12

24 23 22 21 20

THS6182

SLLS544H – SEPTEMBER 2002 – REVISED JUNE 2007

Figure 1. Single-Supply ADSL CO Line Driver Circuit Utilizing Active Impedance (SF = 4)

A.

The PowerPAD is electrically isolated from all active circuity and pins. Connection of the PowerPAD to the PCB

ground plane is highly recommended, although not required, as this plane is typically the largest copper plane on a

PCB. The thermal performance will be better with a large copper plane than a small one.

6

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