ADS5547 datasheet(2/54 Pages) TI

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SHA

11-Bit

ADC

CLOCKGEN

Reference

Digital

Encoder

and

Serializer

Control

Interface

INP

INM

CLKP

CLKM

VCM

CLKOUTP

CLKOUTM

LOW_D0_P

LOW_D0_M

D1_D2_P

D3_D4_P

D5_D6_P

D7_D8_P

D9_D10_P

D1_D2_M

D3_D4_M

D5_D6_M

D7_D8_M

D9_D10_M

OVR

LVDSMODE

ADS5517

SLWS203 – DECEMBER 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION(1)

SPECIFIED

TRANSPORT

PACKAGE-

PACKAGE

ORDERING

PRODUCT

TEMPERATURE

MEDIA,

LEAD

DESIGNATOR

MARKING

NUMBER

RANGE

QUANTITY

Tape and Reel,

ADS5517IRGZT

250

ADS5517

QFN-48(2)

RGZ

–40

°C to 85°C

AZ5517

Tape and Reel,

ADS5517IRGZR

2500

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

For thermal pad size on the package, see the mechanical drawings at the end of this data sheet.

JA = 25.41°C/W (0 LFM air flow),

JC = 16.5°C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in x 3 in (7.62 cm x 7.62

cm) PCB.

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