ADG658/ADG659

Data Sheet

Rev. D | Page 20 of 20

COMPLIANT TO JEDEC STANDARDS MO-137-AB

CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

16

9

8

1

SEATING

PLANE

0.010 (0.25)

0.004 (0.10)

0.012 (0.30)

0.008 (0.20)

0.025 (0.64)

BSC

0.041 (1.04)

REF

0.010 (0.25)

0.006 (0.15)

0.050 (1.27)

0.016 (0.41)

0.020 (0.51)

0.010 (0.25)

8°

0°

COPLANARITY

0.004 (0.10)

0.065 (1.65)

0.049 (1.25)

0.069 (1.75)

0.053 (1.35)

0.197 (5.00)

0.193 (4.90)

0.189 (4.80)

0.158 (4.01)

0.154 (3.91)

0.150 (3.81)

0.244 (6.20)

0.236 (5.99)

0.228 (5.79)

Figure 34. 16-Lead Shrink Small Outline Package [QSOP]

(RQ-16)

Dimensions shown in inches and (millimeters)

ORDERING GUIDE

Model1, 2

Temperature Range

Package Description

Package Option

ADG658YRU

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG658YRU-REEL7

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG658YRUZ

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG658YRUZ-REEL7

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG658YCPZ

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-23

ADG658YCPZ-REEL7

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-23

ADG658YRQ

−40°C to +125°C

16-Lead Shrink Small Outline Package [QSOP]

RQ-16

ADG658YRQZ

−40°C to +125°C

16-Lead Shrink Small Outline Package [QSOP]

RQ-16

ADG658YRQZ-REEL7

−40°C to +125°C

16-Lead Shrink Small Outline Package [QSOP]

RQ-16

ADW54003-0

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADW54003-0RL7

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG659YRU

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG659YRUZ

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG659YRUZ-REEL7

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG659WYRUZ-REEL7

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

ADG659YCPZ

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-23

ADG659YCPZ-REEL7

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-23

ADG659YRQZ

−40°C to +125°C

16-Lead Shrink Small Outline Package [QSOP]

RQ-16

1

Z = RoHS Compliant Part.

2

W = Qualified for Automotive Applications.

AUTOMOTIVE PRODUCTS

The ADW54003 models are available with controlled manufacturing to support the quality and reliability requirements of automotive

applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers

should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in

automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to

obtain the specific Automotive Reliability reports for these models.

©2004–2016 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D03273-0-11/16(D)