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ADS5463IPFPR Datasheet(PDF) 28 Page - Texas Instruments |
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ADS5463IPFPR Datasheet(HTML) 28 Page - Texas Instruments |
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28 / 37 page ![]() Operational Lifetime T ContinuousJunction Temperature C J - - o 1000 100 10 1 80 90 100 110 120 130 140 150 160 170 180 T ContinuousJunction Temperature C J - - o 100 10 1 0.1 130 150 160 170 180 190 200 140 ADS5463 SLAS515B – NOVEMBER 2006 – REVISED MAY 2008 .................................................................................................................................................... www.ti.com It is important for applications that anticipate running continuously for long periods of time near the maximum-rated ambient temperature of +85 °C to consider the data shown in Figure 49 and Figure 50. Referring to the Thermal Characteristics table, the worst-case operating condition with no airflow has a thermal rise of 23.7 °C/W. At approximately 2.2 W of normal power dissipation, at a maximum ambient of +85°C with no airflow, the junction temperature of the ADS5463 reaches approximately +85 °C + 23.7°C/W × 2.2 W = +137°C and therefore the expected lifetime is approximately 8 years due to an electro migration failure and 18 years due to a wirebonding failure. Being even more conservative and accounting for the maximum possible power dissipation that is ensured (2.4 W), the junction temperature becomes nearly +142 °C. As Figure 49 and Figure 50 show, this operating condition limits the expected lifetime of the ADS5463 even more. Operation at +85 °C continuously may require airflow or an additional heatsink in order to decrease the internal junction temperature and increase the expected lifetime. An airflow of 250 LFM (linear feet per minute) reduces the thermal resistance to 16.4 °C/W, the maximum junction temperature to +124 °C and the expected lifetime to over 10 years, assuming a worst-case of 2.4 W and +85 °C ambient. Of course, operation at lower ambient temperatures greatly increases the expected lifetime. The ADS5463 performance over temperature is quite good and can be seen starting in Figure 21. Though the typical plots show good performance at +100 °C, the device is only rated from –40°C to +85°C. For continuous operation at temperatures near or above the maximum, aside from performance degradation, the expected primary negative effect is a shorter device lifetime. Figure 49. Operating Life Derating Chart, Electro Figure 50. Operating Life Derating Chart, Wirebound Migration Fail Mode Voiding Fail Mode 28 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s) :ADS5463 |
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