TMS320DM335 datasheet(99/156 Pages) TI

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5.3.1

Power-Supply Sequencing

5.3.1.1

Power-Supply Design Considerations

5.3.1.2

Power-Supply Decoupling

TMS320DM335

Digital Media System-on-Chip (DMSoC)

www.ti.com

SPRS528 – JULY 2008

In order to ensure device reliability, the DM335 requires the following power supply power-on and

power-off sequences. See table Table 5-1 for a description of DM335 power supplies.

Power-On:

1. Power on 1.3 V: CVDD, VDDA_PLL1/2, VDDD13_USB, VDDA13_USB

2. Power on 1.8 V: VDD_DDR, VDDA18_DAC

3. Power on 3.3 V: DVDD, VDDA33_DDRDLL, VDDA33_USB, VDDA33_USB_PLL, VDD_VIN, VDD_VOUT

You may power-on the 1.8 V and 3.3 V power supplies simultaneously.

Power-Off:

1. Power off 3.3 V: DVDD, VDDA33_DDRDLL, VDDA33_USB, VDDA33_USB_PLL, VDD_VIN, VDD_VOUT

2. Power off 1.8 V: VDD_DDR, VDDA18_DAC

3. Power off 1.3 V: CVDD, VDDA_PLL1/2, VDDD13_USB, VDDA13_USB

You may power-off the 1.8 V and 3.3 V power supplies simultaneously.

Power-off the 1.8v/3.3V supply before or within 10usec of power-off of the 1.3 V supply.

Note that when booting the DM335 from OneNAND, you must ensure that the OneNAND device is ready

with valid program instructions before the DM335 attempts to read program instructions from it. In

particular, before you release DM335 reset, you must allow time for OneNAND device power to stabilize

and for the OneNAND device to complete its internal copy routine. During the internal copy routine, the

OneNAND device copies boot code from its internal non-volatile memory to its internal boot memory

section. Board designers typically achieve this requirement by design of the system power and reset

supervisor circuit. Refer to your OneNAND device datasheet for OneNAND power ramp and stabilization

times and for OneNAND boot copy times.

Core and I/O supply voltage regulators should be located close to the DM335 to minimize inductance and

resistance in the power delivery path. Additionally, when designing for high-performance applications

utilizing the DM335 device, the PC board should include separate power planes for core, I/O, and ground,

all bypassed with high-quality low-ESL/ESR capacitors.

In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as

possible close to DM335. These caps need to be close to the DM335 power pins, no more than 1.25 cm

maximum distance to be effective. Physically smaller caps, such as 0402, are better because of their

lower parasitic inductance. Proper capacitance values are also important. Small bypass caps (near 560

pF) should be closest to the power pins. Medium bypass caps (220 nF or as large as can be obtained in a

small package) should be next closest. TI recommends no less than 8 small and 8 medium caps per

supply be placed immediately next to the BGA vias, using the "interior" BGA space and at least the

corners of the "exterior".

Larger caps for each supply can be placed further away for bulk decoupling. Large bulk caps (on the order

of 100

µF) should be furthest away, but still as close as possible. Large caps for each supply should be

placed outside of the BGA footprint.

Any cap selection needs to be evaluated from a yield/manufacturing point-of-view. As with the selection of

any component, verification of capacitor availability over the product’s production lifetime should be

considered. See also Section 5.5.1 and Section 5.5.2 for additional recommendations on power supplies

for the oscillator/PLL supplies.

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DM335 Peripheral Information and Electrical Specifications

TMS320DM335 Datasheet(PDF) 99 Page - Texas Instruments

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