AMIS-30521 Micro-stepping Motor Driver

Data Sheet

1

2

3

5

4

6

7

8

24

23

22

20

21

19

18

17

910

11

12

13

14

15

16

32

31

30

29

28

27

26

25

DI

ERR

GND

GND

MOTYN

CLK

DIR

NXT

SLA

AMIS-30521

PC20070309.2

GND

GND

GND

MOTYN

MOTXN

MOTXN

Figure 2: Pin Out AMIS-30521

5.1 Package Thermal Characteristics

The NQFP is designed to provide superior thermal performance, and using an exposed die pad on the bottom surface of the package

partly contributes to this. In order to take full advantage of this thermal performance, the PCB must have features to conduct heat away

from the package. A thermal grounded pad with thermal vias can achieve this. With a layout as shown in Figure 3: PCB Ground Plane

Layout Condition, the thermal resistance junction – to – ambient can be brought down to a level of 30°C/W.

Figure 3: PCB Ground Plane Layout Condition

NQFP-32

PC20041128.2

3

AMI Semiconductor

– June 2007, M-20683-001

www.amis.com