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FSFR2000 Datasheet(PDF) 13 Page - Fairchild Semiconductor |
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FSFR2000 Datasheet(HTML) 13 Page - Fairchild Semiconductor |
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13 / 17 page ![]() © 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com FSFR series • 1.0.3 13 drops below -0.9V. This protection is latch mode and reset when LVCC is pulled down below 5V. 5.3 Overload Protection (OLP) : Overload is defined as the load current exceeding its normal level due to an unexpected abnormal event. In this situation, the protection circuit should trigger to protect the power supply. However, even when the power supply is in the normal condition, the overload situation can occur during the load transition. To avoid premature triggering of protection, the overload protection circuit should be designed to trigger only after a specified time to determine whether it is a transient situation or a true overload situation. Figure 27 shows a typical overload protection circuit. By sensing the resonant capacitor voltage on the control pin, the overload protection can be implemented. Using RC time constant, shutdown delay can be also introduced. The voltage obtained on the control pin is given as: 2( ) p p B CON Cr Bsense C VV CC − = + (7) where VCr p-p is the amplitude of the resonant capacitor voltage. 5.4 Over-Voltage Protection (OVP) : When the LVCC reaches 23V, OVP is triggered. This protection is used when auxiliary winding of the transformer to supply VCC to FPS is utilized. 5.5 Thermal Shutdown (TSD) : The MOSFETs and the control IC in one package makes it easy for the control IC to detect the abnormal over-temperature of the MOSFETs. If the temperature exceeds approximately 130 °C, the thermal shutdown triggers. 6. PCB Layout Guideline : Duty unbalance problems may occur due to the radiated noise from main transformer, the inequality of the secondary side leakage inductances of main transformer, and so on. Among them, it is one of the dominant reasons that the control components in the vicinity of RT pin are enclosed by the primary current flow pattern on PCB layout. The direction of the magnetic field on the components caused by the primary current flow is changed when the high and low side MOSFET turns on by turns. The magnetic fields with opposite direction from each other induce a current through, into, or out of the RT pin, which makes the turn- on duration of each MOSFET different. It is highly recommended to separate the control components in the vicinity of RT pin from the primary current flow pattern on PCB layout. Figure 28 shows an example for the duty balanced case. Figure 28. Example for Duty Balancing |
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