THERMAL CHARACTERISTICS

0

25

50

75

100

125

150

0

50

100

150

200

T -CaseTemperature-°C

C

V

at5.5V

CC1,2

PACKAGE CHARACTERISTICS

ISO1176

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

168

θ

JA

Junction-to-air

°C/W

96.1

θ

JB

Junction-to-board thermal resistance

61

°C/W

θ

JC

Junction-to-case thermal resistance

48

°C/W

Device power dissipation

220

mW

Input a 20 MHz 50% duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

Figure 28. DW-16

θ

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

L(I01)

Minimum air gap (Clearance)

Shortest terminal to terminal distance

8.34

mm

through air

L(I02)

Shortest terminal to terminal distance

8.1

mm

across the package surface

CTI

Tracking resistance (Comparative Tracking

DIN IEC 60112 / VDE 0303 Part 1

≥175

V

Index)

Minimum Internal Gap (Internal Clearance)

Distance through the insulation

0.008

mm

Isolation resistance

each side of the barrier tied together

Ω

creating a two-terminal device

Barrier capacitance Input to output

2

pF

Input capacitance to ground

2

pF

(1)

Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care

should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on

the printed circuit board do not reduce this distance.

Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation

Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.

18

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