AD5752 datasheet(30/32 Pages) AD

30 / 32 page

AD5722/AD5732/AD5752

Rev. 0 | Page 30 of 32

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-153-ADT

6.40 BSC

0.15

0.05

0.10 COPLANARITY

TOP VIEW

EXPOSED

PAD

(Pins Up)

BOTTOM VIEW

4.50

4.40

4.30

7.90

7.80

7.70

1.20 MAX

1.05

1.00

0.80

0.65

BSC

0.30

0.19

SEATING

PLANE

0.20

0.09

8°

0°

0.75

0.60

0.45

5.02

5.00

4.95

3.25

3.20

3.15

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 45. 24-Lead Thin Shrink Small Outline Package, Exposed Pad [TSSOP_EP]

(RE-24)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Resolution (Bits)

Temperature Range

INL

TUE (% FSR)

Package Description

Package Option

AD5722AREZ1

−40°C to +85°C

±1 LSB

±0.3

24-Lead TSSOP_EP

RE-24

AD5722AREZ-REEL71

−40°C to +85°C

±1 LSB

±0.3

24-Lead TSSOP_EP

RE-24

AD5732AREZ1

−40°C to +85°C

±4 LSB

±0.3

24-Lead TSSOP_EP

RE-24

AD5732AREZ-REEL71

−40°C to +85°C

±4 LSB

±0.3

24-Lead TSSOP_EP

RE-24

AD5752BREZ1

−40°C to 85°C

±16 LSB

±0.1

24-Lead TSSOP_EP

RE-24

AD5752BREZ-REEL71

−40°C to 85°C

±16 LSB

±0.1

24-Lead TSSOP_EP

RE-24

AD5752AREZ1

−40°C to +85°C

±16 LSB

±0.3

24-Lead TSSOP_EP

RE-24

AD5752AREZ-REEL71

−40°C to +85°C

±16 LSB

±0.3

24-Lead TSSOP_EP

RE-24

1 Z = RoHS Compliant Part.

AD5752 Datasheet(PDF) 30 Page - Analog Devices

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