LT3570

19

3570fa

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

UF Package

24-Lead Plastic QFN (4mm

× 4mm)

(Reference LTC DWG # 05-08-1697)

PACKAGE DESCRIPTION

FE Package

20-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663)

Exposed Pad Variation CB

4.00 ± 0.10

(4 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ± 0.10

24

23

1

2

BOTTOM VIEW—EXPOSED PAD

2.45 ± 0.10

(4-SIDES)

0.75 ± 0.05

R = 0.115

TYP

0.25 ± 0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UF24) QFN 0105

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.70 ±0.05

0.25 ±0.05

0.50 BSC

2.45 ± 0.05

(4 SIDES)

3.10 ± 0.05

4.50 ± 0.05

PACKAGE

OUTLINE

PIN 1 NOTCH

R = 0.20 TYP OR

0.35 × 45° CHAMFER

FE20 (CB) TSSOP 0204

0.09 – 0.20

(.0035 – .0079)

0

° – 8°

0.25

REF

RECOMMENDED SOLDER PAD LAYOUT

0.50 – 0.75

(.020 – .030)

4.30 – 4.50*

(.169 – .177)

13 4 5 6 7 89 10

11

12

14 13

6.40 – 6.60*

(.252 – .260)

3.86

(.152)

2.74

(.108)

20 1918 17 16 15

1.20

(.047)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

TYP

2

2.74

(.108)

0.45

±0.05

0.65 BSC

4.50

±0.10

6.60

±0.10

1.05

±0.10

3.86

(.152)

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

6.40

(.252)

BSC