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LTM4603 Datasheet(PDF) 14 Page - Linear Technology |
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LTM4603 Datasheet(HTML) 14 Page - Linear Technology |
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14 / 24 page ![]() LTM4603/LTM4603-1 14 4603f to the rising edge of the external clock. The frequency range is ±30% around the operating frequency of 1MHz. A pulse detection circuit is used to detect a clock on the PLLIN pin to turn on the phase lock loop. The pulse width of the clock has to be at least 400ns and 2V in amplitude. During the start-up of the regulator, the phase-lock loop function is disabled. INTVCC and DRVCC Connection An internal low dropout regulator produces an internal 5V supply that powers the control circuitry and DRVCC for driving the internal power MOSFETs. Therefore, if the system does not have a 5V power rail, the LTM4603 can be directly powered by Vin. The gate driver current through the LDO is about 20mA. The internal LDO power dissipation can be calculated as: PLDO_LOSS = 20mA • (VIN – 5V) The LTM4603 also provides the external gate driver volt- age pin DRVCC. If there is a 5V rail in the system, it is recommended to connect DRVCC pin to the external 5V rail. This is especially true for higher input voltages. Do not apply more than 6V to the DRVCC pin. A 5V output can be used to power the DRVCC pin with an external circuit as shown in Figure 16. Parallel Operation of the Module The LTM4603 device is an inherently current mode con- trolled device. Parallel modules will have very good current sharing. This will balance the thermals on the design. The voltage feedback equation changes with the variable η as modules are paralleled: VV k R R OUT FB FB = + 06 60 4 . . η η is the number of paralleled modules. Thermal Considerations and Output Current Derating The power loss curves in Figures 7 and 8 can be used in coordination with the load current derating curves in Figures 9 to 12, and Figures 13 to 14 for calculating an approximate θJA for the module with various heat sinking methods. Thermal models are derived from several tem- perature measurements at the bench and thermal modeling analysis. Thermal Application Note 103 provides a detailed explanation of the analysis for the thermal models and the derating curves. Tables 3 and 4 provide a summary of the equivalent θJA for the noted conditions. These equivalent θJA parameters are correlated to the measured values, and are improved with air flow. The case temperature is maintained at 100°C or below for the derating curves. This allows for 4W maximum power dissipation in the total module with top and bottom heatsinking, and 2W power dissipation through the top of the module with an approximate θJC between 6°C/W to 9°C/W. This equates to a total of 124°C at the junction of the device. APPLICATIO S I FOR ATIO Figure 7. 1.5V Power Loss Figure 8. 3.3V Power Loss Figure 9. No Heat Sink OUTPUT CURRENT (A) 0 2.0 2.5 3.5 35 4603 F07 1.5 1.0 12 46 7 0.5 0 3.0 20V LOSS 12V LOSS 5V LOSS OUTPUT CURRENT (A) 0 2.0 2.5 3.5 35 4603 F08 1.5 1.0 12 46 7 0.5 0 3.0 20V LOSS 12V LOSS AMBIENT TEMPERATURE ( °C) 75 0 1 2 3 4 5 6 80 85 90 95 4603 F09 5VIN, 1.5VOUT, 0LFM 5VIN, 1.5VOUT, 200LFM 5VIN, 1.5VOUT, 400LFM |
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