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LTC3561A Datasheet(PDF) 15 Page - Linear Technology |
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LTC3561A Datasheet(HTML) 15 Page - Linear Technology |
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15 / 20 page ![]() LTC3561A 15 3561af does decrease due to the decreasing voltage across the inductor. Applications that require large load step capabil- ity near dropout should use a different topology such as SEPIC, Zeta or single inductor, positive buck/boost. In some applications, a more severe transient can be caused by switching in loads with large (>1μF) input capacitors. The discharged input capacitors are effectively put in paral- lel with COUT, causing a rapid drop in VOUT. No regulator can deliver enough current to prevent this problem, if the switch connecting the load has low resistance and is driven quickly. The solution is to limit the turn-on speed of the load switch driver. A Hot Swap™ controller is designed specifically for this purpose and usually incorporates cur- rent limiting, short-circuit protection, and soft-starting. the losses in LTC3561A circuits: 1) LTC3561A VIN current, 2) switching losses, 3) I2R losses, 4) other losses. 1) The VIN current is the DC supply current given in the electrical characteristics which excludes MOSFET driver and control currents. VIN current results in a small (<0.1%) loss that increases with VIN, even at no load. 2) The switching current is the sum of the MOSFET driver and control currents. The MOSFET driver current results from switching the gate capacitance of the power MOSFETs. Each time a MOSFET gate is switched from low to high to low again, a packet of charge dQ moves from VIN to ground. The resulting dQ/dt is a current out of VIN that is typically much larger than the DC bias current. In continu- ous mode, IGATECHG = fO(QT + QB), where QT and QB are the gate charges of the internal top and bottom MOSFET switches. The gate charge losses are proportional to VIN and thus their effects will be more pronounced at higher supply voltages. 3) I2R Losses are calculated from the DC resistances of the internal switches, RSW, and external inductor, RL. In continuous mode, the average output current flowing through inductor L is “chopped” between the internal top and bottom switches. Thus, the series resistance look- ing into the SW pin is a function of both top and bottom MOSFET RDS(ON) and the duty cycle (DC) as follows: RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC) The RDS(ON) for both the top and bottom MOSFETs can be obtained from the Typical Performance Characteristics curves. Thus, to obtain I2R losses: I2R losses = IOUT2(RSW + RL) 4) Other “hidden” losses such as copper trace and internal battery resistances can account for additional efficiency degradations in portable systems. It is very important to include these “system” level losses in the design of a system. The internal battery and fuse resistance losses can be minimized by making sure that CIN has adequate charge storage and very low ESR at the switching frequency. Other losses including diode conduction losses during dead-time and inductor core losses which generally account for less than 2% total additional loss. APPLICATIONS INFORMATION Figure 5. Power Loss vs Load Currrent Hot Swap is a trademark of Linear Technology Corporation. Efficiency Considerations The percent efficiency of a switching regulator is equal to the output power divided by the input power times 100%. It is often useful to analyze individual losses to determine what is limiting the efficiency and which change would produce the most improvement. Percent efficiency can be expressed as: %Efficiency = 100% – (L1 + L2 + L3 + ...) where L1, L2, etc. are the individual losses as a percent- age of input power. Although all dissipative elements in the circuit produce losses, four main sources usually account for most of LOAD CURRENT (mA) 0.01 0.1 0.1 10 100 10000 1000 3561A F01 0.001 1 1 VIN = 3.6V VOUT = 1.2V TO 1.8V fO = 1MHz |
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