LTC4080X

19

4080Xf

Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,

no responsibility is assumed for its use. Linear Technology Corporation makes no representation that

the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTIO

DD Package

10-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1699)

3.00

±0.10

(4 SIDES)

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229

VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA

SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

0.38

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

2.38

±0.10

(2 SIDES)

1

5

10

6

PIN 1

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DD10) DFN 1103

0.25

± 0.05

2.38

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.15

±0.05

0.50

BSC

0.675

±0.05

3.50

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.50 BSC

MSOP (MSE) 0603

0.53

± 0.152

(.021

± .006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 – 0.27

(.007 – .011)

TYP

0.127

± 0.076

(.005

± .003)

0.86

(.034)

REF

0.50

(.0197) BSC

12 3 45

4.90

± 0.152

(.193

± .006)

0.497

± 0.076

(.0196

± .003)

REF

8

9

10

10

1

7 6

3.00

± 0.102

(.118

± .004)

(NOTE 3)

3.00

± 0.102

(.118

± .004)

(NOTE 4)

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR

GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL

NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm

(.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE

0.102mm (.004") MAX

0.254

(.010)

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.305

± 0.038

(.0120

± .0015) TYP

2.083

± 0.102

(.082

± .004)

2.794

± 0.102

(.110

± .004)

0.50

(.0197) BSC

BOTTOM VIEW OF

EXPOSED PAD OPTION

1.83

± 0.102

(.072

± .004)

2.06

± 0.102

(.081

± .004)

MSE Package

10-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1664)