2

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© 2000 IMP, Inc.

Pin Configuration

Ordering Information

10

T6

9

HEAT SINK / GND

8

GND

7

HEAT SINK / GND

6

T5

5

T4

4

T3

3

T2

2

T1

1

DISCONNECT 1

14

13

T9

12

T8

11

T7

19 T13

20 HEAT SINK / GND

21 HEAT SINK / GND

22 HEAT SINK / GND

DWP Package

23 T14

24 T15

25 T16

26 T17

27 T18

28 DISCONNECT 2

15 NC

16 T10

17 T11

18 T12

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IMP5225

SOWB-28

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Thermal Data

TermPwr Voltage . . . . . . . . . . . . . . . . . . . . . . . . +7V

Signal Line Voltage

. . . . . . . . . . . . . . . . . . . . . 0V to +7V

Differential Voltage . . . . . . . . . . . . . . . . . . . . . 0V to 6.5V

Operating Junction Temperature

Plastic (DWP Package) . . . . . . . . . . . . . . . . 150

°C

Note:

1. Exceeding these ratings could cause damage to the device. All

voltages are with respect to Ground. Currents are positive

into, negative out of the specified terminal.

Storage Temperature Range . . . . . . . . . . . . . . –65

°C to 150°C

Lead Temperature (Soldering, 10 sec.) . . . . . . 300

°C

DWP Package:

Thermal Resistance Junction-to-Leads,

Thermal Resistance Junction-to-Ambient,

The

device/pc-board system. All of the ambient airflow is assumed.

IMP5

IMP5225

IMP5225