THS6002

DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS

SLOS202D– JANUARY 1998– REVISED JULY 1999

24

POST OFFICE BOX 655303

TYPICAL CHARACTERISTICS

t – Time – ns

VCC = ±15 V

Gain = 5

RL = 150 Ω

RF = 2 kΩ

tr/tf= 5 ns

See Figure 4

RECEIVER OUTPUT

20 V STEP RESPONSE

4

–4

0

–8

12

8

0

150

100

50

200

250

350

300

400

450 500

16

–12

–16

Figure 51

APPLICATION INFORMATION

The THS6002 contains four independent operational amplifiers. Two are designated as drivers because of their

high output current capability, and two are designated as receivers. The receiver amplifiers are current feedback

topology amplifiers made for high-speed operation and are capable of driving output loads of at least 80 mA.

The drivers are also current feedback topology amplifiers. However, the drivers have been specifically designed

to deliver the full power requirements of ADSL and therefore can deliver output currents of at least 400 mA at

full output voltage.

The THS6002 is fabricated using Texas Instruments 30-V complementary bipolar process, HVBiCOM. This

process provides excellent isolation and high slew rates that result in the device’s excellent crosstalk and

extremely low distortion.

independent power supplies

Each amplifier of the THS6002 has its own power supply pins. This was specifically done to solve a problem

that often occurs when multiple devices in the same package share common power pins. This problem is

crosstalk between the individual devices caused by currents flowing in common connections. Whenever the

current required by one device flows through a common connection shared with another device, this current,

in conjunction with the impedance in the shared line, produces an unwanted voltage on the power supply. Proper

power supply decoupling and good device power supply rejection helps to reduce this unwanted signal. What

is left is crosstalk.

However, with independent power supply pins for each device, the effects of crosstalk through common

impedance in the power supplies is more easily managed. This is because it is much easier to achieve low

common impedance on the PCB with copper etch than it is to achieve low impedance within the package with

either bond wires or metal traces on silicon.