THS6002

DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS

SLOS202D– JANUARY 1998– REVISED JULY 1999

26

POST OFFICE BOX 655303

APPLICATION INFORMATION

device protection features

The THS6002 has two built-in protection features that protect the device against improper operation. The first

protection mechanism is output current limiting. Should the output become shorted to ground the output current

is automatically limited to the value given in the data sheet. While this protects the output against excessive

current, the device internal power dissipation increases due to the high current and large voltage drop across

the output transistors. Continuous output shorts are not recommended and could damage the device.

Additionally, connection of the amplifier output to one of the supply rails (

and is not recommended.

The second built-in protection feature is thermal shutdown. Should the internal junction temperature rise above

approximately 180

_C, the device automatically shuts down. Such a condition could exist with improper heat

sinking or if the output is shorted to ground. When the abnormal condition is fixed, the internal thermal shutdown

circuit automatically turns the device back on.

thermal information

The THS6002 is packaged in a thermally-enhanced DWP package, which is a member of the PowerPAD family

of packages. This package is constructed using a downset leadframe upon which the die is mounted

[see Figure 52(a) and Figure 52(b)]. This arrangement results in the lead frame being exposed as a thermal pad

on the underside of the package [see Figure 52(c)]. Because this thermal pad has direct thermal contact with

the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal

pad.

The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.

During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be

soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,

heat can be conducted away from the package into either a ground plane or other heat dissipating device. This

is discussed in more detail in the

PCB design considerations section of this document.

The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of

surface mount with the, heretofore, awkward mechanical methods of heatsinking.

DIE

Side View (a)

End View (b)

Bottom View (c)

DIE

Thermal

Pad

NOTE A: The thermal pad is electrically isolated from all terminals in the package.

Figure 52. Views of Thermally Enhanced DWP Package