TPIC1501A

QUAD AND HEX POWER DMOS ARRAY

SLIS046A – MAY 1995 – REVISED JUNE 1996

6

POST OFFICE BOX 655303

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

trr

Reverse-recovery time

IS = 750 mA,

VDS 14 V

VGS = 0,

di/dt

100 A/

µs

60

ns

QRR

Total diode charge

VDS = 14 V,

See Figures 2 and 23

di/dt = 100 A/

µs,

55

nC

trr

Reverse-recovery time

IS = 1.5 A,

VGS = 0,

120

ns

QRR

Total diode charge

S

VDS = 14 V,

GS

di/dt = 100 A/

µs

150

nC

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

td(on)

Turn-on delay time

18

td(off)

Turn-off delay time

VDD = 14 V,

RL = 18.7 Ω,ten = 10 ns,

25

ns

tr

Rise time

DD

,

tdis = 10 ns,

L

,

See Figure 3

en

,

13

ns

tf

Fall time

20

Qg

Total gate charge

V14 V

I

750

A

V10 V

1.6

2

Qgs(th)

Threshold gate-to-source charge

VDS = 14 V,

See Figure 4

ID = 750 mA,

VGS = 10 V,

0.26

0.32

nC

Qgd

Gate-to-drain charge

See Figure 4

0.42

0.52

L(drain)

Internal drain inductance

5

nH

L(source) Internal source inductance

5

nH

r(gate)

Internal gate resistance

0.25

Ω

thermal resistance

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

R

θJA

Junction-to-ambient thermal resistance

See Notes 5 and 8

90

R

θJB

Junction-to-board thermal resistance

See Notes 6 and 8

38

°C/W

R

θJP

Junction-to-pin thermal resistance

See Notes 7 and 8

28

NOTES:

5. Package is mounted on a FR4 printed-circuit board with no heat sink.

6. Package is mounted on a 24 in2, 4-layer FR4 printed-circuit board.

7. Package is mounted in intimate contact with infinite heat sink.

8. All outputs have equal power.