SE95DP datasheet(27/27 Pages) NXP

27 / 27 page

NXP Semiconductors

SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 2 September 2009

Document identifier: SE95_7

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

21. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

Functional description . . . . . . . . . . . . . . . . . . . 4

7.1

General operation . . . . . . . . . . . . . . . . . . . . . . . 4

7.2

OS output and polarity . . . . . . . . . . . . . . . . . . . 6

7.3

OS comparator and interrupt modes . . . . . . . . 6

7.4

OS fault queue . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.5

Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . 7

7.6

Power-up default and power-on reset . . . . . . . . 7

8I2C-bus serial interface . . . . . . . . . . . . . . . . . . . 7

8.1

Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 7

8.2

8.3

8.4

Conﬁguration register . . . . . . . . . . . . . . . . . . . . 9

8.5

Temperature register. . . . . . . . . . . . . . . . . . . . . 9

8.6

Overtemperature shutdown threshold

and hysteresis registers . . . . . . . . . . . . . . . . . 11

8.7

Protocols for writing and reading

the registers . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15

Recommended operating conditions. . . . . . . 15

Static characteristics. . . . . . . . . . . . . . . . . . . . 16

Dynamic characteristics . . . . . . . . . . . . . . . . . 17

Performance curves . . . . . . . . . . . . . . . . . . . . 18

Application information. . . . . . . . . . . . . . . . . . 19

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20

Soldering of SMD packages . . . . . . . . . . . . . . 22

16.1

Introduction to soldering . . . . . . . . . . . . . . . . . 22

16.2

Wave and reﬂow soldering . . . . . . . . . . . . . . . 22

16.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22

16.4

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 23

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25

Legal information. . . . . . . . . . . . . . . . . . . . . . . 26

19.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26

19.2

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

19.3

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

19.4

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Contact information . . . . . . . . . . . . . . . . . . . . 26

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

SE95DP Datasheet(PDF) 27 Page - NXP Semiconductors

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