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TLE8262E Datasheet(PDF) 86 Page - Infineon Technologies AG

Part # TLE8262E
Description  Universal System Basis Chip HERMES Rev. 1.0
PDF  93 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

TLE8262E Datasheet(HTML) 86 Page - Infineon Technologies AG

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Data Sheet
86
Rev. 1.0, 2009-03-31
TLE8262E
Application Information
Note: This is a very simplified example of an application circuit and bill of material. The function must be verified
in the actual application.
Table 25
Bills of material
Ref.
Option Vendor
Value
Purpose
Capacitance
C1
Y
Kemet
68µF optional depending on
application
Cut off battery spike
C2
Y
100nF
EMC
C3
N
Murata
10µF ceramic cap low ESR
Stability of the
V
CC3
C5
N
1nF OEM dependent
LIN Master Termination
C7
Y
22nF 50V
EMC
C8
Y
47nF OEM dependent
Improve SPLIT pin stability
C9
Y
10µF
Buffer of the
V
CC1µC depending on load.
(µC)
C10
N
100nF
Stability of the
V
CC1µC
C11
N
10µF CAN transceiver dependent
Buffering of the
V
CC2 for CAN Transceiver
C12
Y
100nF
Improve stability of the logic
C13
Y
100nF
Improve stability of the logic
C14
Y
100nF
Improve stability of the logic
Resistance
R1
N
220m
Ω
V
CC3 current measurement for ICC3
400mA max
R3
Y
1k
Ω / OEM dependent
LIN master termination
R5
Y
1k
Ω
Wetting current of the switch
R7
Y
60
Ω / OEM dependent
CAN bus termination
R8
Y
60
Ω / OEM dependent
CAN bus termination
R9
Y
10k
Ω
Limit the WK pin current in ISO pulses
R10
Y
500
Ω
Insulation of the VDD supply
R12
Y
47k
Ω
Set config 1/3. If not connected config 2/4
is selected



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