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MIC22700 Datasheet(PDF) 15 Page - Micrel Semiconductor

Part # MIC22700
Description  1MHz, 7A Integrated Switch High Efficiency Synchronous Buck Regulator
PDF  21 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC22700 Datasheet(HTML) 15 Page - Micrel Semiconductor

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Micrel, Inc.
MIC22700
July 2009
15
M9999-072209-B
An alternative method here shows an example of a VDDQ
& VTT solution for a DDR memory power supply. Note
that POR is taken from Vo1 as POR2 will not go high.
This is because POR is set high when FB > 0.9
⋅VREF. In
this example, FB2 is regulated to ½⋅VREF.
Current Limit
The MIC22700 is protected against overload in two
stages. The first is to limit the current in the P-channel
switch; the second is over temperature shutdown.
Current is limited by measuring the current through the
high side MOSFET during its power stroke and
immediately switching off the driver when the preset limit
is exceeded.
The circuit in Figure 4 describes the operation of the
current limit circuit. Since the actual RDSON of the P-
Channel MOSFET varies part-to-part, over temperature
and with input voltage, simple IR voltage detection is not
employed. Instead, a smaller copy of the Power
MOSFET (Reference FET) is fed with a constant current
which is a directly proportional to the factory set current
limit. This sets the current limit as a current ratio and
thus, is not dependant upon the RDSON value. Current
limit is set to nominal value. Variations in the scale factor
K between the Power PFET and the reference PFET
used to generate the limit threshold account for a
relatively small inaccuracy.
Figure 4. Current Limit Detail
Thermal Considerations
The MIC22700 is packaged in the MLF
® 4mm x 4mm, a
package that has excellent thermal performance
equaling that of the larger TSSOP packages. This
maximizes heat transfer from the junction to the exposed
pad (ePAD) which connects to the ground plane. The
size of the ground plane attached to the exposed pad
determines the overall thermal resistance from the
junction to the ambient air surrounding the printed circuit
board. The junction temperature for a given ambient
temperature can be calculated using:
TJ = TAMB + PDISS · RθJA
Where
•
PDISS is the power dissipated within the MLF
®
package and is typically 1.5W at 7A load. This
has been calculated for a 1µH inductor and
details can be found in table 1 below for
reference.



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