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ST7732 Datasheet(PDF) 3 Page - Sitronix Technology Co., Ltd. |
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ST7732 Datasheet(HTML) 3 Page - Sitronix Technology Co., Ltd. |
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3 / 168 page ![]() ST7732 Ver 1.5.2 2007-12 3 3. Pad arrangement View point: bump view Chip size (um): 13500 x 700 PAD coordinate: pad center Coordinate origin: chip center Chip thickness (um): 300±15 Bump height (um): 15±3 Bump hardness (HV): 75±25 Pad arrangement (Unit: um): Output: pad No. 1 ~ 585 = 21 x 96 21 23 96 35 96 22 Input: pad No. 586 ~ 760 = 55 x 96 Alignment mark (unit: um): (-6627.5, -195.5) (6627.5, -195.5) |
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