WM8181

Advanced Information

WOLFSON MICROELECTRONICS LTD

AI Rev 3.0 January 2000

14

PACKAGE DIMENSIONS

Symbols

Dimensions

(mm)

Dimensions

(Inches)

MIN

MAX

MIN

MAX

A

2.35

2.65

0.0926

0.1043

0.10

0.30

0.0040

0.0118

B

0.33

0.51

0.0130

0.0200

C

0.23

0.32

0.0091

0.0125

D

10.10

10.50

0.3465

0.3622

e

1.27 BSC

0.0500 BSC

E

7.40

7.60

0.2914

0.2992

h

0.25

0.75

0.0100

0.0290

H

10.00

10.65

0.3940

0.4190

L

0.40

1.27

0.0160

0.0500

α

0

o

8

o

0

o

8

o

REF:

JEDEC.95, MS-013

NOTES:

A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).

B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).

D. MEETS JEDEC.95 MS-013, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.

DM019.A

DW: 16 PIN SOICW 7.5mm (0.3") Wide Body, 1.27mm Lead Pitch

L

A

16

D

e

B

1

8

9

α

C

E

H

SEATING PLANE

A1

-C-

0.10 (0.004)