SS6526 datasheet(8/12 Pages) SSC

8 / 12 page

10/23/2007 Rev.1.00

www.SiliconStandard.com

APPLICATION INFORMATION

Error Flag

An error Flag is an open-drained output of an

N-channel MOSFET. FLG output is pulled low to

signal

the

following

fault

conditions:

input

undervoltage, output current limit, and thermal

shutdown.

Current Limit

The current limit threshold is preset internally. It

protects the output MOSFET switches from

damage resulting from undesirable short circuit

conditions or excess inrush current, which is

often encountered during hot plug-in. The low

limit of the current limit threshold of the

SS6526

allows a minimum current of 0.6A through the

MOSFET switches. The error flag signals when

any current limit conditions occur.

Thermal Shutdown

When temperature of

SS6526 exceeds 135°C

for any reasons, the thermal shutdown function

turns both MOSFET switches off and signals the

error flag. A hysteresis of 10

°C prevents the

MOSFETs from turning back on until the chip

temperature drops below 125

°C. However, if

thermal

shutdown

triggered

chip

temperature rise resulting from overcurrent fault

condition of either one of the MOSFET switches,

the thermal shutdown function will only turn off

the switch that is in overcurrent condition and

the other switch can still remain its normal

operation. In other words, the thermal shutdown

function of the two switches is independent of

each other in the case of overcurrent fault.

Supply Filtering

A 0.1

µF to 1µF bypass capacitor from IN to GND,

located

near

the

device,

strongly

recommended

control

supply

transients.

Without a bypass capacitor, an output short may

cause sufficient ringing on the input (from supply

lead inductance) to damage internal control

circuitry.

Transient Requirements

USB supports dynamic attachment (hot plug-in)

of peripherals. A current surge is caused by the

input capacitance of downstream device. Ferrite

beads are recommended in series with all power

and

ground connector

pins.

Ferrite

beads

reduce EMI and limit the inrush current during

hot-attachment

filtering

high-frequency

signals.

Short Circuit Transient

Bulk

capacitance

provides

the

short-term

transient

current

needed

during

hot-attachment event. A 33

µF/16V tantalum or a

100

µF/10V electrolytic capacitor mounted close

to downstream connector each port should

provide transient drop protection.

Printed Circuit Layout

The power circuitry of USB printed circuit boards

requires a customized layout to maximize

thermal dissipation and to minimize voltage drop

and EMI.

SS6526

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