SS8117G datasheet(2/6 Pages) SSC

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ABSOLUTE MAXIMUM RATINGS

(Note 1)

Input Voltage………………………………………………………………………………………….…7V

Power Dissipation Internally Limited

(Note 2)

Maximum Junction Temperature…...…………………………………………………………….…..150°C

Storage Temperature Range…..……………………………………….................…………..-65°C

≤ T

≤+150°C

Reflow Temperature (soldering, 10secs)

SOT 223 Package…….……………………………………………………….....…..…………....260°C

Continuous Power Dissipation (TA = +25°C)

SOT 223

(1) ……………………...……………………………………………………………………..0.8W

Note

(1): See Recommended Minimum Footprint

OPERATING CONDITIONS

(Note 1)

(VIN-VADJ) Voltage………..……………………………………………….......……………….……2.5V~6.5V

Temperature Range…………………………………………………………...............….……..-40°C

≤ T

≤85°C

ELECTRICAL CHARACTERISTICS

Operating Conditions: VIN

≤ 6.5V, TJ = 25°C unless otherwise specified. [Note3]

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Reference Voltage

VIN - VOUT = 2V, IOUT = 10mA

1.225

1.250

1.275

Line Regulation

(VOUT + 1.5V) < VIN < 6.5V, IOUT = 10mA

1.32

Load Regulation

(VIN - VOUT) = 2V, 10mA < IOUT < 800mA

0.04

Dropout Voltage

∆V

OUT = 2%, IOUT = 800mA

1.2

1.3

Current Limit

(VIN - VOUT) = 2V

1000

1200

Adjust Pin Current Change

VIN - VOUT = 2V, 10mA < IOUT < 1mA

0.15

µA

Minimum Load Current

1.5V < (VIN - VOUT) < 5.25V

Quiescent Current

VIN - VOUT = 2V

µA

Ripple Rejection

f = 120Hz, COUT = 10µF Tantalum,

(VIN - VOUT) = 3V, IOUT = 800mA

Thermal Regulation

TA = 25°C, 30ms pulse

0.004

0.02

%/W

Temperature Stability

VIN = 4V, IO =10mA

0.3

RMS Output Noise (% of VOUT)

TA = 25°C, 10Hz < f < 10kHz, ILOAD = 10mA

0.007

Thermal Resistance,Junction-to-Ambient

(No heat sink; No air flow)

SOT-223; Recommended Minimum Footprint

156

°C/W

Thermal Shutdown

Junction Temperature

150

°C

Thermal Shutdown Hysteresis

°C

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions

are conditions under which the device functions but the specifications might not be guaranteed. For guaran-

teed specifications and test conditions see the Electrical Characteristics.

Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal re-

s istance,

JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient te m-

perature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the IC

will go into thermal shutdown. For the SS8117G in SOT 223 package,

JA is 156°C/W (See recommended

minimum footprint). For safe operation in SOT 223 package, see “Typical Performance Characteristics” (Safe

Operating Area).

Note3: Low duty cycle pulse techniques are used during test to maintain junction te mperature as close to

SS8117G

5/26/2005 Rev.2.2

ambient temperature as possible.

Note4: The output capacitor should be tantalum or aluminum .

∆V

OUT = 2%, IOUT = 1A

1.3

1.4

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