2N7002KA_3

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 — 25 February 2008

4 of 11

NXP Semiconductors

2N7002KA

N-channel TrenchMOS FET

5.

Thermal characteristics

[1]

Mounted on a printed-circuit board; minimum footprint; vertical in still air.

Table 4.

Thermal characteristics

Symbol Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from junction to solder point

see Figure 4

-

-

150

K/W

thermal resistance from junction to ambient

[1] -

350

-

K/W

Fig 4.

Transient thermal impedance from junction to solder point as a function of pulse duration

003aab351

1

10

10

2

10

3

10

-5

10

-4

10

-3

10

-2

10

-1

1

10

(K/W)

single pulse

0.2

0.1

0.05

δ =0.5

0.02

T

P

t

T

δ =