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2N7002KA Datasheet(PDF) 5 Page - NXP Semiconductors

Part # 2N7002KA
Description  N-channel TrenchMOS FET
PDF  11 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

2N7002KA Datasheet(HTML) 5 Page - NXP Semiconductors

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2N7002KA_3
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 — 25 February 2008
5 of 11
NXP Semiconductors
2N7002KA
N-channel TrenchMOS FET
6.
Characteristics
Table 5.
Characteristics
Tj =25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
V(BR)DSS
drain-source breakdown
voltage
ID =10 µA; VGS =0V
Tj =25 °C
6075-
V
Tj = −55 °C
55
--V
V(BR)GSS
gate-source breakdown
voltage
IG = ±1 mA; VDS = 0 V
16
22
-
V
VGS(th)
gate-source threshold voltage ID = 1 mA; VDS =VGS; see Figure 9 and 10
Tj =25 °C
12-
V
Tj = 150 °C
0.6
-
-
V
Tj = −55 °C
-
-
3.5
V
IDSS
drain leakage current
VDS =48V; VGS =0V
Tj =25 °C
-
0.01
1
µA
Tj = 150 °C
--10
µA
IGSS
gate leakage current
VGS = ±10 V; VDS = 0 V
-
50
500
nA
RDSon
drain-source on-state
resistance
VGS = 10 V; ID = 500 mA; see Figure 6 and 8
Tj =25 °C
-
2.8
4.4
Ω
Tj = 150 °C
-
-
8.14
Ω
VGS = 4.5 V; ID = 75 mA; see Figure 6 and 8
-
3.8
5.3
Ω
Dynamic characteristics
Ciss
input capacitance
VGS =0V; VDS = 10 V; f = 1 MHz;
see Figure 12
-
1340pF
Coss
output capacitance
-
8
30
pF
Crss
reverse transfer capacitance
-
4
10
pF
ton
turn-on time
VDS =50V; RL = 250 Ω; VGS =10V;
RG =50 Ω; RGS =50 Ω
-
3
10
ns
toff
turn-off time
-
9
15
ns
Source-drain diode
VSD
source-drain voltage
IS = 300 mA; VGS = 0 V; see Figure 11
-
0.85
1.5
V
trr
reverse recovery time
IS = 300 mA; dIS/dt = −100 A/µs; VGS =0V;
VDS =25V
-30
-
ns
Qr
recovered charge
-
30
-
nC



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