TAS5631

SLES221C – JULY 2009 – REVISED APRIL 2010

www.ti.com

PRINTED CIRCUIT BOARD RECOMMENDATION

Use an unbroken ground plane to have good low-impedance and -inductance return path to the power supply for

power and audio signals. PCB layout, audio performance and EMI are linked closely together. The circuit

contains high, fast-switching currents; therefore, care must be taken to prevent damaging voltage spikes. Routing

for the audio input should be kept short and together with the accompanying audio source ground. It is important

to keep a solid local ground area underneath the device to minimize ground bounce.

Netlist for this printed circuit board is generated from the schematic in Figure 14.

Note T1: PVDD decoupling bulk capacitors C60–C64 should be as close as possible to the PVDD and GND_X pins;

the heat sink sets the distance. Wide traces should be routed on the top layer with direct connection to the pins and

without going through vias. No vias or traces should be blocking the current path.

Note T2: Close decoupling of PVDD with low-impedance X7R ceramic capacitors is placed under the heat sink and

close to the pins.

Note T3: Heat sink must have a good connection to PCB ground.

Note T4: Output filter capacitors must be linear in the applied voltage range, and preferably metal film types.

Figure 19. Printed Circuit Board – Top Layer

24

Submit Documentation Feedback

Copyright © 2009–2010, Texas Instruments Incorporated

Product Folder Link(s): TAS5631