BGA2802

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 1 — 24 February 2011

2 of 18

NXP Semiconductors

BGA2802

MMIC wideband amplifier

3.

Ordering information

4.

Marking

5.

Limiting values

6.

Thermal characteristics

7.

Characteristics

Table 2.

Ordering information

Type number

Package

Name

Description

Version

BGA2802

-

plastic surface-mounted package; 6 leads

SOT363

Table 3.

Marking

Type number

Marking code

Description

BGA2802

MA*

* = - : made in Hong Kong

* = p : made in Hong Kong

* = W : made in China

* = t : made in Malaysia

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

supply voltage

RF input AC coupled

−0.5

3.6

V

supply current

-

55

mA

total power dissipation

200

mW

storage temperature

−40

+125

°C

junction temperature

-

125

°C

drive power

-

−16.5 dBm

Table 5.

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

thermal resistance from junction to

solder point

300

K/W

Table 6.

Characteristics

Symbol Parameter

Conditions

Min

Typ

Max

Unit

supply voltage

3.0

3.3

3.6

V

supply current

9.8

12.5

15.2

mA