CHRG_

POL

CHRG_

DET

TFBGA36 PACKAGE

(BOTTOM VIEW)

VBAT

VBUS

REFCLK

SOF

CHRG_

EN_N

FAULT

REG3V3

GND

DIR

REG1V5

DP

GND

ID

PSW

DXT

STP

DM

CS_N

RESET_N

GND

DATA7

DATA0

VDDIO

CS

CFG

VDDIO

DATA6

DATA1

DATA2

DATA3

CLOCK

DATA4

DATA5

A

1

4

2

5

3

6

B

C

D

E

F

NC

(1)

TUSB1211

www.ti.com

SLLSE80 – MARCH 2011

1

2.1

Terminal Description

(1)

NC = Not Connected

(2)

The size of the device should be 3.5 mm ±0.1 mm by 3.5 mm ±0.1 mm. Height is 1.0 mm typical 1.15 mm max including the solder

balls. The pitch of the device is 0.5 mm. Ball width 0.3 mm ±0.05 mm.

Figure 2-1. TFBGA36 Package - Bottom View

Table 2-1 provides a description of the signals on the TUSB1211 package; some signals are available on

multiple pins.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright © 2011, Texas Instruments Incorporated

Description

7

Submit Documentation Feedback

Product Folder Link(s): TUSB1211