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MICRF008 Datasheet(PDF) 7 Page - Micrel Semiconductor |
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MICRF008 Datasheet(HTML) 7 Page - Micrel Semiconductor |
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7 / 13 page ![]() Micrel, Inc. MICRF008 August 2008 7 M9999-080108 proportional to REFOSC frequency. The nominal value of RSC given in the “Electrical Characteristics ” Table is 220kΩ for a REFOSC frequency of 3.36MHz. Slicing level time constant value vary depending on data pattern, data rate and data duty cycle. Automatic Gain Control (AGC) The signal path has automatic gain control (AGC) to increase the overall receiver dynamic range. An external capacitor, CAGC, must be connected to the CAGC pin of the device. Normally the CAGC capacitor is connected to ground. If faster start-up times are required when the receiver is first poweredon, the CAGC capacitor may be connected to VDD. The ratio of decay-to-attack time constant is fixed at 10:1 (that is, the attack time constant is 1/10th of the decay time constant), and the user cannot change this ratio. Nevertheless, the attack time constant is set externally by choosing a value for CAGC. Another function of the AGC control voltage is to raise the noise floor in order to guarantee a clean signal between the preamble and the data, sometimes called dead time. The AGC control voltage can be further manipulated and amplified to create an RSSI signal, which is useful for several different applications. Reference Oscillator All timing and tuning operations on the MICRF008YM are derived from the internal Colpitts reference oscillator. The reference frequency can be implemented in two ways, by using a resonator device (a ceramic resonator or crystal), or by driving an external signal, which should not exceed 0.5VRMS. The reference frequency is obtained by dividing the RF carrier frequency by 129. I/O Pin Interface Circuitry Interface circuitry for the various I/O pins of the MICRF008 is shown in Figures 2 through 6. Specific information regarding each of these circuits is discussed in the following subparagraphs. Not shown are ESD protection diodes which are applied to all input pins. CTH Pin Figure 2 illustrates the CTH pin interface circuit. CTH pin is driven from a P-Channel MOSFET source-follower biased with approximately 20μA of bias current. Transmission gates TG1 and TG2 isolate the 3.3pF capacitor. Internal control signals PHI1/PHI2 are related in a manner such that the impedance across the transmission gates looks like a “resistance.” The DC potential on the CTH pin is approximately 2.2V, fundamentally determined by the VGS of the two PChannel MOSFET source-followers shown. 3.3pF PHI2B TG1 TG2 PHI1B PHI1 PHI2 CTH DC-coupled Switched Cap. Filter VDDBB VSSBB VSSBB 20µA VDDBB VSSBB 20µA Demod Signal (0Vdc) Figure 2. CTH Pin CAGC Pin Figure 3 illustrates the CAGC pin interface circuit. The AGC control voltage is developed as an integrated current into a capacitor CAGC. The attack current is nominally 15μA, while the decay current is a 1/10th scaling of this, approximately 1.5μA. Signal gain of the RF/IF strip inside the IC diminishes as the voltage on CAGC decreases. By simply adding a capacitor to CAGC pin, the attack/decay time constant ratio is fixed at 1:10. VDDBB VSSBB Compa- rator 1.5µA 15µA CAGC Figure 3. CAGC Pin DO Pin The output stage for the Data Comparator (DO pin) is shown in Figure 4. The output is a 10μA push-10μA pull, switched current stage. Such an output stage is capable of driving CMOS-type loads. |
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